Canteliver Probe Card
MPI Cantilever Probe Card is commonly applied on gold bump and pad wafer screening for display driver, logic, and memory system. MPI’s cantilever probes will be the corresponding respond to towards the needs of fine pitch, smaller pad sizing, higher speed, a lot less cleansing, multi-DUT, high pin count, and ultra-reduced leakage needs. With remarkable craftsmanship, revolutionary architecture and verified methodologies based upon mechanical and electrical simulation/measurement effects, earning MPI the best cantilever service provider worldwide.
FCB Probe Card
The FCB Probe Card is the most experienced technology of buckling beam probe card. It is aimed to obtain the semiconductor ship manufacture time-to-market (TTM) and price of exam (COT) demand from customers. FCB is often a established Resolution for various semiconductor creation tests from early engineering pilot-operates to significant volume manufacturing (HVM). FCB is prepared for system necessitating higher sign integrity probing (SI) and/or electricity integrity probing (PI). Programs include chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, and a lot more. FCB guarantees the world’s most effective Over-all Expense-of-possession (COO) for a variety of DUT applications.
EVS Probe Card
The EVS Probe Card is really an enhancement over the standard buckling beam probe card. Crucial features are better existing carrying potential (C.C.C.) and reduced balanced Get in touch with drive (BCF), along with overall MEMS-like features. EVS can easily meet up with the need of Superior wafer probing. Specific alignment and outstanding planarity Command are classified as the key variables contributing to secure Make contact with resistance. With its potential and overall performance, EVS Probe Card is a really perfect option for Superior probe playing cards.
Osprey probe card
The Osprey probe card is MPI’s Alternative to need for ever finer pitch. It can be suitable for more compact Al pad, which is perfect for tiny pitch application with peripheral and entire array sample. With precise alignment and far better planarity Command, Osprey can reach larger productiveness by multi-DUT layout. The forming wire (FW) style needle generated with MPI’s individual micro fabrication course of action not merely provides large-quality functionality but will also enables uncomplicated needle substitution and shortens maintaining cycle time.
Kestrel Probe Card
The Kestrel Probe Card is equipped with MEMS wire (MW) needle which is designed for the demand of reduced pressure probing. Furthermore, it comes with the opportunity to satisfy significant C.C.C. and high pin counts application. The MEMS approach makes sure extremely reliable needle traits, plus the special structure layout allows specific alignment and planarity Command.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level website test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/